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Apex
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AI for chip design

Chip design. Done by the model.

Aether for semiconductors drives a complete chip flow: 3DIC architecture, RTL, physical implementation, IP integration, verification, multiphysics signoff and manufacturing. Specialist agents, a comprehensive silicon-IP catalog, and tape-outs in production.

First-rev
functional silicon
Unlimited
chip-design workloads · one model
Tape-out
in production
The AI, animated

What the model actually computes.

These are the workloads the AI runs in chip design — rendered live in SVG. Each panel is the geometry the model is reasoning about, the physics it solves for, and the validation it lands against measured reality.

01 · Live SVG
Chip design — physical implementation
RTL → signoff · ≤0.4% WNS gap vs commercial EDA
02 · Live SVG
Advanced packaging — 3D-IC, photonics
Chiplets · interposer · backside power
The AI

Aether is the AI doing the chip design work.

Three things to know about the AI underneath every workload on this page. We aren't building a chat surface for your team — we are training a foundation model that plans, runs and reports.

The AI does the discipline

Not a chat interface over your engineers. A foundation model that plans the study, picks the method, runs the agents, validates against measured reality and writes the report. The same shape an experienced practitioner would follow — done by the model.

One model, your context

We don't ship a sibling model per industry. The same Aether weights serve every discipline, but the agents on top are trained against your standards, your historical data and your regulatory posture.

Reality is the regulariser

We train on simulation, instrument and design data — not scraped text. The model gets better the more reality it touches. Reality is what tells it when it's wrong.

A customer in chip design

Helix Silicon.

“First silicon came back functional on the first revision.”

RTL to signoff on a 4nm SoC — without an incumbent-EDA renewal.

Headline metric
0
EDA license servers
Product
Aether for semiconductors
What the AI runs here

The work, done by Aether.

These are the workloads Aether already runs in chip design. Not a wish-list. Each ships with validated benchmarks and traces a senior engineer can read end-to-end.

  • 01

    3DIC architecture

    Chiplet partitioning, interposer planning, thermal-aware floorplanning for stacked dies, UCIe + BoW interconnect modelling.

  • 02

    Physical implementation

    Synthesis, placement, clock-tree, routing, congestion management. RTL in, GDS out, DFM-aware from the first iteration.

  • 03

    Verification & signoff

    Functional, formal, multiphysics signoff across PVT corners. UVM testbench generation from spec; coverage closure with explainable traces.

  • 04

    Manufacturing & lifecycle

    DFM rules, yield analysis, mask prep, OPC, in-field telemetry, reliability and aging models — pinned to your foundry's PDK.

  • 05

    Processor configuration

    ARC-V (RISC-V) and NPU configuration. Per-workload PPA tuning, custom instruction extensions, vector and matrix unit sizing.

  • 06

    Security & root-of-trust

    Side-channel hardening, fault-injection analysis, secure-boot, post-quantum primitives baked into the flow.

AI for chip design

“We are building the AI that does chip design — not the one that talks about it. Aether doesn't ask your engineers to drive its solvers. It runs the work, validates the artefact and writes the memo.”

What it replaces

The stack today.

The typical stack in chip design — a half-dozen seven-figure renewals stitched together with internal glue code. We replace the spine; we don't touch the niches that work.

Logic synthesis
Place-and-route
Static timing analysis
Functional verification
Power and IR signoff
DFM and OPC
The specialists at play

The agents in the mix.

Aether coordinates these specialist agents for chip design. Each is independently deployable, but the coordination — and the foundation model underneath — is what makes them more than a folder of scripts.

3DICphysical implIP integrationverificationmultiphysicsmanufacturinglifecycleprocessor configSoC interconnectsecurityagingDSO
Regulatory & boundary

How we ship into regulated chip design.

The pieces that matter to procurement, security review and the regulator. We ship into industries where the boundary is real and the audit is unforgiving.

  • Foundry-pack IP isolation with version-pinned process kits

  • ITAR / EAR-aware deployment topologies for defence silicon

  • Hash-verified GDS hand-off and abstract-cell signing

  • DRC / LVS / antenna / density sign-off rule decks in production

FAQ

Questions about chip design.

  • What does Aether replace in chip design?

    The incumbent stack here — Logic synthesis, Place-and-route, Static timing analysis, Functional verification and more — collapses into one model and one project file, with Aether for semiconductors doing the work under one safety story.

  • What outcomes should we expect?

    First-rev (functional silicon); Unlimited (chip-design workloads · one model); Tape-out (in production) — scoped to your workload and measured against your own acceptance criteria.

  • How does a pilot work?

    Three to eight weeks against a workload and a win condition you co-author. We run alongside your incumbent stack on real cases; if we aren't better on the metric by quarter end, the rest of the quarter is on us.

  • Can it deploy inside our boundary?

    Yes — managed, in your VPC, on-prem or fully air-gapped on Aether Cloud, with the audit trail and provenance the regulated parts of this work require.

The AI is ready for chip design.

Send us the workload that hurts. We'll come back with a scoped pilot — three to eight weeks, win condition co-authored. If we aren't better on the metric by quarter end, the rest of the quarter is on us.